CE Series
Application
Cantilever probe card with cantilever probe wires attached to epoxy ring.
CE Series is a probe card technology suitable for testing various types of logic IC such as application processors from transistor devices.
Features
1.
Stable contact on aluminum pads with alloy probes
2.
Reduces under-pad damage due to its low probe force pressure and low scrubbing.
3.
Longer probe card life with less frequent cleaning required
4.
Reduces test costs through multi-DUT testing
5.
Supports fine-pitch pad layouts (In-line/staggered)
Specifications [Al Pad for Logic device]
| Pitch (um) | 50 |
| Pad size(um) | 60 |
| Number of pins | 3K |
| Probing area(mm) | 100×150 |
| Contact Force (gf) | 1.0 |
| Max OD (um) | 90 |
| Temperature range(℃) | -40/200 |
| Max. DC current (A) CCC | 1.0 |
| Frequency(Gbps) | 0.5 |
*specifications are subject to change without notice
Contact