MT Series
Application
MEMS probe card created with MEMS (Micro Electro Mechanical Systems) and thin film multilayer wiring technology. Supports fine-pitch area arrays by use of vertical MEMS probe. MT Series is a probe technology developed for flip chips with Cu pillar bumps.
Features
1.
Vertical MEMS Probe Technology for Fine‑Pitch Area Array Applications
2.
Supports high‑parallelism and fine‑pitch Cu pillar probing
3.
Easy maintenance with individually replaceable probes
4.
Low contact load with stable contact resistance
5.
Designed for high‑current and high‑temperature test environments
6.
Optimized for high‑speed signal integrity, enabling next‑generation devices validation
Specifications [for Solder Bump , Cu Pillar , Pad]
|
Solder Bump |
Pad |
|
| Pitch (um) | 70-120 | 50-70 |
| Number of pins | 50K | 15K |
| Probing area(mm) | 50✕50 | 100✕100 |
| Contact Force (gf) | 1.6-4.0 | 2.0-3.0 |
| Max OD (um) | 100-120 | 100 |
| Temperature range(℃) | -40/125 | -40/150 |
| CCC (A) | 0.75-1.45 | 0.65-0.75 |
| Frequency(Gbps) | 64 | 16 |
*specifications are subject to change without notice
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