MT Series
Application
MEMS probe card created with MEMS (Micro Electro Mechanical Systems) and thin film multilayer wiring technology. Supports fine-pitch area arrays by use of vertical MEMS probe. MT Series is a probe technology developed for flip chips with Cu pillar bumps.
Features
1.
Vertical probe card that uses MEMS probe
2.
Supports area array layouts
3.
Enables testing before installing Cu Pillar
4.
Supports high current capacity
5.
Stable contact by use of low probe force
6.
Individual probes and probe unit can be replaced.
Specifications [for Solder Bump , Cu Pillar , Pad]
| Solder Bump / for Cu pillar | Pad | ||
| Probe Type | MT70F | MT120FC | MT50P |
| Pitch (um) | 70 | 120 | 54 |
| Pad size(um) | - | - | - |
| Number of pins | 50K | 35K | 10K |
| Probing area(mm) | 50×50 | ||
| Contact Force (gf) | 1.7 | 2.6 | 2.0 |
| Max OD (um) | 120 | 120 | 100 |
| Temperature range(℃) | -40/125 | -40/125 | -40/150 |
| Max. DC current (A) CCC | 0.80 | 1.45 | 0.65 |
| Frequency(Gbps) *Lookback | 64 | 64 | 64 |
*specifications are subject to change without notice
Contact