MC Series
Application
MEMS probe card created with MEMS (Micro Electro Mechanical Systems) and thin film multilayer wiring technology. Supports full wafer probing for 300mm wafers.
MC Series is a probe card technology suitable for DRAM and NAND flash memory devices.
Features
1.
MEMS Micro‑Cantilever Type for memory Testing
2.
Utilizes MEMS probe structures and thin‑film processes for precision and reliability
3.
Supports 300 mm 1TD wafer probing for mass‑production environments
4.
Achieves high density and high pin count for next‑generation devices
5.
Maintains excellent signal integrity for high‑speed application
6.
Operates under high‑temperature conditions required for advanced reliability testing
Specifications [ for full-wafer memory probing ]
| Pitch (um) | 57 |
| Pad size(um) | 45X57 |
| Number of pins | 200K |
| Probing area(mm) | Φ300 |
| Contact Force (gf/mil) | 0.6 |
| Max OD (um) | 100 |
| Temperature range(℃) | -40/125 |
| Max. DC current (A) CCC | 0.7 |
| Frequency(Gbps) *Non-Share | 3.2 |
*specifications are subject to change without notice
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