MC Series
Application
MEMS probe card created with MEMS (Micro Electro Mechanical Systems) and thin film multilayer wiring technology. Supports full wafer probing for 300mm wafers.
MC Series is a probe card technology suitable for DRAM and NAND flash memory devices.
Features
1.
Stable contact due to low scrubbing across the whole pad
2.
High parallelism probing reduces test cost per DUT and shortens test time
3.
High current capability and high abrasion-resistant probe
4.
Enables testing over wide temperature range
Specifications [for full‐wafer memory probing]
| Pitch (um) | 57 |
| Pad size(um) | 45X59 |
| Number of pins | 150K |
| Probing area(mm) | Φ300 |
| Contact Force (gf/mil) | 0.5 |
| Max OD (um) | 100 |
| Temperature range(℃) | -40/125 |
| Max. DC current (A) CCC | 0.7 |
| Frequency(Mbps) | 250 |
*specifications are subject to change without notice
Contact