VC Series
Application
Vertical probe card with buckling structure. Supports 12-inch size wafer batch contact.
VC Series is a probe card technology designed for high-parallelism testing of memory and logic devices
Features
1.
VC probes are proven to have stable contact and versatile with higher overdrive tolerance
2.
Ideal for devices with small pad sizes and fine pitch due to small probe marks
3.
Enables testing over wide temperature range
4.
Economical full-wafer probing solution without space transformer required
5.
fine-pitch pad layouts
Specifications [for memory, MCU, smartcard]
| Pitch (um) | 90 |
| Pad size(um) | 65×65（PA300） |
| Number of pins | 15K |
| Probing area(mm) | Φ300 |
| Contact Force (gf/mil) | 0.7 |
| Max OD (um) | 180 |
| Temperature range(℃) | -30~85（PA300） |
| 25~125（PA300） | |
| 150（PA300） | |
| Max. DC current (A) CCC | 0.4 |
| Frequency(Gbps) | 0.65 |
*specifications are subject to change without notice
Contact