VS Series
Application
Vertical probe card with micro spring pins can support various attachment methods such as wire transformer, MLO, MLC and direct attachment.
VS Series is a probe card technology recommended for flip chip, area array, and wafer-level CSP.
Features
1.
Uses a spring pin
2.
Wide selection of tip shapes (crown/pointed/flat) and pin geometries available.
3.
Individual spring pins can be replaced.
4.
Enable matrix array with multiple-pins
5.
Supports pad contact before mounting solder ball (Cu Pillar)
6.
Probe head can be replaced
Specifications [for bumps, pads]
| Item | Flat | Crown | Point |
| Pitch (um) | 150 | ||
| Pad/Bump size(um) | - | Bump Φ55～58 |
Pad 60×60 |
| Number of pins | 20K | ||
| Probing area(mm) | 50x50 | ||
| Contact Force (gf) |
7.1 |
5.1 |
5.7 |
| Max OD (um) | 350 | 170 | 170 |
| Temperature range(℃) | -43/126 | ||
| Max. DC current (A) CCC | 1.5 | 1.35 | 1.4 |
*specifications are subject to change without notice
Contact