VE Series
Application
A hybrid probe card structure combining vertical and cantilever probe card features.
VE Series is a probe card technology developed for high-parallelism testing of CMOS imaging sensors with openings for light source.
Features
1.
Low scrub on pads minimizes debris on probe tips and debris dropping onto wafer
2.
Optimized DUT layout improves touchdown efficiency.
3.
Enables testing over wide temperature range.
4.
High frequency capability available for MIPI D-phy.
Specifications [for image sensors]
| Pitch (um) | 100 |
| Pad size(um) | 60×75 |
| Number of pins | 3K |
| Probing area(mm) | 160×150 |
| Contact Force (gf) | 2 |
| Max OD (um) | 90 |
| Temperature range(℃) | 75 |
| Max. DC current (A) CCC | 0.4 |
| Frequency(Gbps) | 10 |
*specifications are subject to change without notice
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